Near-surface bismuth donors are promising for silicon quantum devices because of their rich electron-nuclear spin structure and long spin coherence, but their electrical activation is strongly influenced by implantation-induced amorphization. We compare redistribution and electrical activation of 20 keV Bi implanted directly into Si and after Si preamorphization. The two routes produce amorphous-layer depths of approximately 47 nm and 177 +/- 15 nm, respectively. After annealing at 650 C for 300 s, Rutherford backscattering spectrometry and channeling reveal comparable substitutional Bi fractions of 91 +/- 2% and 89 +/- 4%, whereas Hall measurements indicate Hall-derived electrical activation yields of approximately 60% and 90%, respectively. Depth-resolved ion-scattering analysis reveals a buried Bi-related feature at or beyond the initial amorphous/crystalline interface, within the end-of-range region, together with increasing surface segregation at higher annealing temperatures. The buried feature is consistent with trapping near residual end-of-range defects. X-ray photoelectron spectroscopy and low-temperature photoluminescence on the Bi-only sample reveal no resolvable Bi-oxide contribution and a donor-related optical signature, respectively. These results show that amorphization depth and regrowth geometry govern Bi redistribution and influence electrical activation beyond substitutional incorporation alone.